HIWIN Wafer Aligner

Feature

HPA series is a three axis controlled wafer aligner, utilizing HIWIN miniature single axis robot module providing advantages of high speed, high precision and high efficiency in compact size.
Controller inbuilt (All-in-one design), does not need controller setup or cable space. Most compact design under same specifications.
Equipped with intelligent through beam laser sensors, supporting contour detection function of transparent, translucent and opaque objects and suitable for diameters of 100~300mm.
Cleanliness level of the product is ISO Class 3 (Class 1), suitable for applications including semiconductor and opto-electronics.

Application

Semiconductor Industry

Other Semiconductor Subsystem

Other Products

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